Cost Savings Form in Place, Reduce process cost |
Varies Available Varies of conductive materials are available |
Low stress Low stress, high compression |
| Models | Conductive Filler | Curing Conditions | Curing Time | Hardness | Volume Resistivity | Adhesion Strength | Flammability Rating | Shelf Life |
Curing Temperature | hour@temperature | shoreA | ohm- cm | @200MHz- 10GHz dB | UL-94 | -20℃ months | ||
| EFIP 451H | Ni/C ; | High Temperature Curing | 30MIN@150℃ | 45 | 0.04 | >90 | V0 | 6 |
| EFIP 604R | Ag/Al | Room Temperature Curing | 12H@25℃ | 60 | 0.008 | >100 | V0 | 6 |
| EFIP 602R | Ag/Cu | Room Temperature Curing | 24H@25℃ | 60 | 0.003 | >110 | V0 | 6 |
| EFIP 503R | Ag/Ni | Room Temperature Curing | 24H@25℃ | 50 | 0.005 | >100 | V0 | 6 |
| EFIP 553H | Ag/Ni | High Temperature Curing | 2H@120℃ | 55 | 0.01 | >100 | V0 | 6 |
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