FIP (form-in-place) dispensing molding process, according to the customer's different product design, through computer-aided programming dispensing equipment, through the automation system will conductive glue precise place coated in metal, plastic and other substrate curing to form a shielding gaskets, in order to achieve EMI shielding and grounding effect.
Optical module
Communication equipment
smart phone
tablet
laptop
UAV equipment
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Since its establishment, it has adhered to the tenet of customer-centric and creating value for customers, and concentrated design, R&D, manufacturing and other comprehensive advantages to operate collaboratively to serve customers
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Copyright:Emtron performance materials Case number: Technical support: E Power