The thermal pad is used to connect the interface between the thermal component and the chassis or radiator assembly to increase the overall heat transfer of the system. The unique combination of thermal conductivity and flexibility reduces mechanical stress, and is mainly used for gap filling of heat sinks in the semiconductor device domain to achieve effective heat transfer, greatly reduce interface thermal resistance, and give full play to the role of heat sinks.
Realize the effective heat transfer, greatly reduce the interface thermal resistance, and give full play to the role of the heat sink.
It is specially designed to be used in applications sensitive to silicon precipitation, to meet the special fields of optical communication, security, automotive electronics, high-end industrial control and medical electronics, etc.
Used between the high-power processor and the heat dissipation module, the low thermal resistance improves the heat transfer capacity between the heating part and the heat dissipation part. After reaching the temperature, the phase change occurs, automatically filling the smile gap, and the surface has strong wettability.
Thermally conductive insulating sheets are mainly used in occasions that require heat conduction but also have strict requirements on insulation, such as power modules, high-frequency switches, and high-power amplifiers. It is made of thermally conductive silicone rubber and has a base material. Its special structure enables the thermally conductive insulating sheet to have low thermal resistance, high insulation and anti-puncture functions.
5G optical communication
new energy vehicles
automated industry
Consumer Electronics
Medical equipment
Please enter the following information to obtain
Since its establishment, it has adhered to the tenet of customer-centric and creating value for customers, and concentrated design, R&D, manufacturing and other comprehensive advantages to operate collaboratively to serve customers
Wechat QR code
Website QR Code
Copyright:Emtron performance materials Case number: Technical support: E Power