FIP (form-in-place) dispensing molding process, according to the customer's different product design, through computer-aided programming dispensing equipment, through the automation system will conductive glue precise place coated in metal, plastic and other substrate curing to form a shielding gaskets, in order to achieve EMI shielding and grounding effect.

• Ultra low body resistance, can achieve excellent shielding performance
• Suitable for automation program, can meet the requirements of high precision operation
• Can achieve small space dispensing, suitable for small size or small cavity
• High temperature curing, high adhesion and resilience, to ensure long-time use of high reliability